发明名称 |
Capacitive micro-machined transducer and method of manufacturing the same |
摘要 |
The present invention relates to a method of manufacturing a capacitive micro-machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectric film (20) on the first electrode layer (10), depositing a sacrificial layer (30) on the first dielectric film (20), the sacrificial layer (30) being removable for forming a cavity (35) of the transducer, depositing a second dielectric film (40) on the sacrificial layer (30), and depositing a second electrode layer (50) on the second dielectric film (40), wherein the first dielectric film (20) and/or the second dielectric film (40) comprises a first layer comprising an oxide, a second layer comprising a high-k material, and a third layer comprising an oxide, and wherein the depositing steps are performed by Atomic Layer Deposition. The present invention further relates to a capacitive micro-machined transducer (100), in particular a CMUT, manufactured by such method. |
申请公布号 |
US9231496(B2) |
申请公布日期 |
2016.01.05 |
申请号 |
US201314369341 |
申请日期 |
2013.01.18 |
申请人 |
Koninklijke Philips N.V. |
发明人 |
Dirksen Peter;Mauczok Ruediger;Karakaya Koray;Klootwijk Johan Hendrik;Marcelis Bout;Mulder Marcel |
分类号 |
H02N1/00;B06B1/02;B81C1/00;B81B3/00;H02N1/08 |
主分类号 |
H02N1/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a capacitive micro-machined transducer (CMUT), the method comprising:
depositing a first electrode layer on a substrate, depositing a first dielectric film on the first electrode layer, depositing a sacrificial layer on the first dielectric film, the sacrificial layer being removable for forming a cavity of the transducer, depositing a second dielectric film on the sacrificial layer, and depositing a second electrode layer on the second dielectric film, wherein the first dielectric film and/or the second dielectric film comprises a first layer comprising an oxide, a second layer comprising a high-k material having a dielectric constant equal to 8 or more, and a third layer comprising an oxide, and wherein the second layer is sandwiched between the first and the third layer and the depositing steps are performed by Atomic Layer Deposition. |
地址 |
Eindhoven NL |