Thermal management in electronic apparatus with phase-change material and silicon heat sink

摘要

Embodiments of an electronic apparatus with a thermal management technique utilizing a silicon heat sink and/or a phase-change material, as well as an assembling method thereof, are described. In one aspect, the electronic apparatus comprises a main unit, a phase-change material and an enclosure enclosing the main unit and the phase-change material. The main unit comprises a substrate and at least one integrated-circuit (IC) chip disposed on the substrate. The phase-change material is in direct contact with each IC chip of the at least one IC chip to absorb and dissipate heat generated by the at least one IC chip.

主权项

1. An electronic apparatus, comprising:
a main unit, comprising:
a substrate, andat least one integrated-circuit (IC) chip disposed on the substrate; a thermal management unit, comprising:
a silicon heat sink coupled to the at least one IC chip and comprising a base portion and a fin portion, the fin portion comprising a plurality of fins protruding from the base portion,a phase-change material in direct contact with at least the fin portion of the silicon heat sink and configured to absorb at least a portion of heat that is generated by the at least one IC chip and transferred through the silicon heat sink, anda container coupled to the silicon heat sink and configured to contain the phase-change material therein; and an enclosure enclosing the main unit and the thermal management unit therein.