Redistribution layers for microfeature workpieces, and associated systems and methods

摘要

Redistribution layers for microfeature workpieces, and associated systems and methods are disclosed. One method for processing a microfeature workpiece system includes positioning a pre-formed redistribution layer as a unit proximate to and spaced apart from a microfeature workpiece having an operable microfeature device. The method can further include attaching the redistribution layer to the microfeature workpiece and electrically coupling the redistribution layer to the operable microfeature device.

主权项

1. A microfeature workpiece system, comprising;
a first microfeature workpiece having a semiconductor substrate with a first surface, a second surface opposite the first surface, and a redistribution layer over the semiconductor substrate, wherein the semiconductor substrate includes no operable microfeature devices formed between the first and second surfaces and wherein the semiconductor substrate comprises silicon; a second microfeature workpiece adjacent the first microfeature workpiece, the second microfeature workpiece having at least one operable microfeature device and an interconnect structure electrically coupled to the microfeature device; and a conductive via extending entirely through the semiconductor substrate of the first microfeature workpiece, wherein the conductive via electrically connects the interconnect structure to the redistribution layer of the first microfeature workpiece.