Adhesive compound and method for encapsulating an electronic arrangement

摘要

The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.

主权项

1. A method for encapsulating an electronic arrangement against permeants, in which an electronic arrangement is provided on a substrate, said method comprising:
a) providing a first web material comprising the electronic arrangement on the substrate, optionally in the form of a multiplicity of individual electronic arrangements, b) providing a second web material comprising an adhesive sheet-like structure, optionally as a continuous area or individual sheetlike diecuts disposed on a carrier, c) providing an apparatus comprising (i) a vacuum chamber and (ii) a pair of rolls together forming a roll nip and at the same time sealing off the vacuum chamber, d) passing the two web materials into the roll nip and into the vacuum chamber via the pair of rolls, e) laminating the adhesive sheetlike structure with the electronic arrangement to form a resultant laminate in a vacuum in the roll nip, and f) leading the resultant laminate away from the vacuum chamber through the roll nip of the pair of rolls.