发明名称 Semiconductor devices and methods of manufacturing the same
摘要 A semiconductor device includes a first non-flat non-polar nitride semiconductor layer, a first structure layer on at least a portion of the surface of the first non-flat non-polar nitride semiconductor layer and a first non-polar nitride semiconductor layer on the first non-flat non-polar nitride semiconductor layer and the first structure layer. The first non-flat non-polar nitride semiconductor layer includes a plurality of solid particles.
申请公布号 US9230804(B2) 申请公布日期 2016.01.05
申请号 US201113242827 申请日期 2011.09.23
申请人 SAMSUNG ELECTRONICS CO., LTD.;SNU R&DB FOUNDATION 发明人 Lee Sangmoon;Yoon Euijoon;Park Jinsub;Park Sung Hyun
分类号 H01L29/778;H01L21/02 主分类号 H01L29/778
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A semiconductor device comprising: a first non-flat non-polar nitride semiconductor layer; a first structure layer on at least a portion of a surface of the first non-flat non-polar nitride semiconductor layer, the first structure layer including a first plurality of solid particles, the first plurality of solid particles being formed of at least one oxide material; and a first non-polar nitride semiconductor layer on the first non-flat non-polar nitride semiconductor layer and the first structure layer, the first structure layer being between the first non-polar nitride semiconductor layer and at least the portion of the surface of the first non-flat non-polar nitride semiconductor layer.
地址 Gyeonggi-Do KR