发明名称 |
Semiconductor devices and methods of manufacturing the same |
摘要 |
A semiconductor device includes a first non-flat non-polar nitride semiconductor layer, a first structure layer on at least a portion of the surface of the first non-flat non-polar nitride semiconductor layer and a first non-polar nitride semiconductor layer on the first non-flat non-polar nitride semiconductor layer and the first structure layer. The first non-flat non-polar nitride semiconductor layer includes a plurality of solid particles. |
申请公布号 |
US9230804(B2) |
申请公布日期 |
2016.01.05 |
申请号 |
US201113242827 |
申请日期 |
2011.09.23 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SNU R&DB FOUNDATION |
发明人 |
Lee Sangmoon;Yoon Euijoon;Park Jinsub;Park Sung Hyun |
分类号 |
H01L29/778;H01L21/02 |
主分类号 |
H01L29/778 |
代理机构 |
Harness, Dickey & Pierce, P.L.C. |
代理人 |
Harness, Dickey & Pierce, P.L.C. |
主权项 |
1. A semiconductor device comprising:
a first non-flat non-polar nitride semiconductor layer; a first structure layer on at least a portion of a surface of the first non-flat non-polar nitride semiconductor layer, the first structure layer including a first plurality of solid particles, the first plurality of solid particles being formed of at least one oxide material; and a first non-polar nitride semiconductor layer on the first non-flat non-polar nitride semiconductor layer and the first structure layer, the first structure layer being between the first non-polar nitride semiconductor layer and at least the portion of the surface of the first non-flat non-polar nitride semiconductor layer. |
地址 |
Gyeonggi-Do KR |