| 摘要 |
The present invention relates to an aligning apparatus capable of minimizing an error in mounting a surface mounted device (SMD) while efficiently aligning the SMD if the SMD is required to be arranged in a horizontal row structure on a printed circuit board and to be aligned without displacement, and to a manufacturing method of a backlight unit using the same. More specifically, the aligning apparatus includes: a transfer means which is driven by external force; a carrier jig which arranges printed circuit boards, on which multiple SMDs in the same shape are mounted in a line, at regular intervals, and is transferred in one direction by the transfer means; a guide plate which is placed apart from an upper side of the transfer means, and guides the carrier jig to be transferred in one direction; and an aligning block which is joined to a location, facing each printed circuit board, on a lower side of the guide plate and sequentially aligns the SMDs on each printed circuit board in the carrier jig which enters the guide plate and is transferred thereto. |
