| 摘要 |
The present invention relates to a polyimide film. According to the present invention, the polyimide film exhibits excellent adhesiveness among thermoplastic polyimides. In addition, chemical resistance such as film elongation is not significantly changed even if being exposed to an alkali environment. Therefore, the polyimide film can be widely used in electrical/electronic materials, space/air fields, and telecommunication fields. The polyimide film is obtained from a polyamic acid derivative formed of aromatic acid dianhydride including pyromellitic dianhydride (PMDA); and aromatic diamine including 3,5-diaminobenzoic acid (DABA) and 1,3-Bis(4-aminophenoxy)benzene (TPE-R). |
