| 摘要 |
The present invention is to form a line performed with the division even on a part which is covered with a second brittle substrate on a first brittle substrate while avoiding the unintended division. A tip is slid on a first main surface (SF1) of the first brittle substrate (11) so as to form a trench line (TL). The trench line (TL) is formed to obtain a crackless state. The first and second brittle substrates (11, 12) are bonded to each other so as to allow the trench line (TL), which is formed on the first brittle substrate (11), to be covered at least a part by the second brittle substrate (12). Next, a crack of the first brittle substrate (11) is extended in the thickness direction along the trench line (TL) so as to form a crack line (CL). The first brittle substrate (11) is positioned underneath the trench line (TL) by the crack line (CL), so the first brittle substrate (11) is not continuously connected in a direction crossing the trench line (TL). |
