| 摘要 |
According to the present invention, a semiconductor module without a tie bar in a tab pin is disclosed. The semiconductor module comprises: a printed circuit board having an integrated circuit chip loaded thereon; connecting terminals arranged at an edge part of the printed circuit board; via holes arranged in signal lines which correspondingly connect electrical connection pads of the integrated circuit chip to the connecting terminals; and plating lines connected to the via holes. The connecting terminals are plated by using the via holes of the printed circuit board connected to the plating lines. |
