PROCEDE ET SYSTEME DE STRUCTURATION SUBMICROMETRIQUE D'UNE SURFACE DE SUBSTRAT

摘要

The subject of the invention is a process for submicron structuring of a surface (6) of a substrate (3) comprising the steps of generating a plasma at atmospheric pressure above said surface (6); and of injecting onto said surface (3), through said plasma, at least one gaseous precursor by means of at least one capillary (5) of submicron diameter. The process may be carried out in a 3D printing system comprising a plate (2) that is mobile in three directions.