SUBSTRATE PROCESSING APPARATUS

摘要

A technique for reducing the amount of particles adhering to a substrate with a simple structure is provided. A substrate processing apparatus is an apparatus for processing a substrate by ejecting a processing liquid from a nozzle. The substrate processing apparatus includes supply piping and an air-bubble capturing part. One end of the supply piping is connected via a first filter for removing particles to a tank of a processing-liquid supply part that supplies the processing liquid, and the other end of the supply piping is connected to the nozzle. The air-bubble capturing part is inserted at a position between the first filter and the nozzle in the supply piping, and captures air bubbles contained in the processing liquid. Pressure loss caused by the air-bubble capturing part is approximately equal to or smaller than pressure loss caused by the first filter.

主权项

1. A substrate processing apparatus for processing a substrate by ejecting a processing liquid, comprising:
an ejection part that ejects a processing liquid toward said substrate; supply piping having one end connected to a processing-liquid supply part via a first filter and the other end connected to said ejection part, said processing-liquid supply part supplying said processing liquid, and said first filter removing particles; and an air-bubble capturing part that is inserted at a position between said first filter and said ejection part in said supply piping and captures air bubbles contained in said processing liquid, wherein pressure loss caused by said air-bubble capturing part is approximately equal to or smaller than pressure loss caused by said first filter.