SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND RECORDING MEDIUM

摘要

Provided is a substrate processing method which can remove part of a layer to be processed formed on a substrate under a normal pressure atmosphere while suppressing an effect on the substrate. A raw material of the layer to be processed which is decomposed by irradiating an ultraviolet ray under an oxygen-containing atmosphere, is coated on a substrate (W). The layer to be processed is formed by heating the raw material coated on the substrate (W). Subsequently, the substrate (W) having the layer to be processed is arranged in a process chamber (61) at an oxygen-containing atmosphere with a gas flow rate of 10 cm/sec or less. An ultraviolet ray is irradiated to the substrate (W). So, part of the layer to be processed is removed.