发明名称 WIRING BOARD HAVING ELECTRICAL ISOLATOR AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING THE SAME
摘要 A method of making a wiring board having an electrical isolator and metal posts incorporated in a resin core is characterized by the provision of moisture inhibiting caps covering interfaces between the electrical isolator/metal posts and a surrounding plastic material. In a preferred embodiment, the electrical isolator and metal posts are bonded to the resin core by an adhesive substantially coplanar with the metal films on the electrical isolator, the metal posts and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface to completely cover interfaces between the electrical isolator/metal posts and the surrounding plastic material. Conductive traces are also deposited on the smoothed lapped top surface to provide electrical contacts for chip connection and electrically coupled to the metal posts.
申请公布号 US2015382468(A1) 申请公布日期 2015.12.31
申请号 US201514846987 申请日期 2015.09.07
申请人 BRIDGE SEMICONDUCTOR CORPORATION 发明人 Lin Charles W. C.;Wang Chia-Chung
分类号 H05K1/18;H05K1/02;H05K1/11;H05K3/00 主分类号 H05K1/18
代理机构 代理人
主权项 1. A method of making a wiring board having electrical isolator and moisture inhibiting cap incorporated therein, comprising steps of: providing a metallized slug that includes an electrical isolator and first and second metal films respectively deposited on first and second sides of the electrical isolator, wherein the first and second metal films each have a planar outer surface in opposite first and second directions, respectively; providing metal posts each having planar first and second sides in the first and second directions, respectively; providing a stacking structure that includes first and second metal layers, a binding film disposed between the first and second metal layers, a first aperture, and second apertures extending through the first metal layer, the binding film and the second metal layer, wherein the first and second metal layers each have a planar outer surface in the first and second directions, respectively; inserting the metallized slug into the first aperture of the stacking structure and the metal posts into the second apertures of the stacking structure leaving gaps between the stacking structure and the metallized slug and between the stacking structure and the metal posts, and then curing the binding film to form a resin core that has a first side bonded to the first metal layer and an opposite second side bonded to the second metal layer, wherein the stacking structure is adhered to sidewalls of the metallized slug and the metal posts by an adhesive squeezed out from the binding film into the gaps between the stacking structure and the metallized slug and between the stacking structure and the metal posts; removing an excess portion of the squeezed out adhesive, thereby the adhesive having opposite exposed surfaces substantially coplanar with the outer surfaces of the first and second metal films and the first and second metal layers and the first and second sides of the metal posts in the first and second directions; forming conductive traces that includes contact pads and routing circuitries, wherein the contact pads laterally extend on the second side of the electrical isolator, and the routing circuitries electrically connect the contact pads and metal posts from the second direction; and forming moisture inhibiting caps that laterally extend from the first metal film of the metallized slug to the first metal layer, and laterally extend from the first side of the metal posts to the first metal layer to completely cover the exposed surface of the adhesive from the first direction.
地址 Taipei TW