THERMALLY ENHANCED WIRING BOARD HAVING METAL SLUG AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING THE SAME

摘要

A method of making a wiring board having a metal slug incorporated in a resin core is characterized by the provision of a moisture inhibiting cap covering interfaces between metal and plastic. In a preferred embodiment, the metal slug is bonded to the resin core by an adhesive substantially coplanar with the metal slug and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface to completely cover interfaces between the metal slug and the surrounding plastic material. In the method, conductive traces are also deposited on the resin core at the smoothed lapped top surface so as to provide electrical contacts for chip connection.

主权项

1. A method of making a thermally enhanced wiring board having metal slug and moisture inhibiting cap incorporated therein, comprising steps of:
providing a metal slug having planar first and second sides in opposite first and second directions, respectively; providing a stacking structure that includes first and second metal layers, a binding film disposed between the first and second metal layers, and a first aperture extending through the first metal layer, the binding film and the second metal layer, wherein the first and second metal layers each have a planar outer surface in the first and second directions, respectively; inserting the metal slug into the first aperture of the stacking structure leaving a gap between the stacking structure and the metal slug, and then curing the binding film to form a resin core that has a first side bonded to the first metal layer and an opposite second side bonded to the second metal layer, wherein the stacking structure is adhered to sidewalls of the metal slug by an adhesive squeezed out from the binding film into the gap between the stacking structure and the metal slug; removing an excess portion of the squeezed out adhesive, thereby the adhesive having opposite exposed surfaces substantially coplanar with the first and second sides of the metal slug and the outer surfaces of the first and second metal layers in the first and second directions; forming conductive traces that laterally extend on the second side of the resin core; and forming a first moisture inhibiting cap that laterally extends from the first side of the metal slug to the first metal layer to completely cover the exposed surface of the adhesive from the first direction.