DOUBLE-SIDED FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING PLATING LAYER AND METHOD OF MANUFACTURING THE SAME

摘要

Disclosed is a double-sided flexible printed circuit board, including a flexible substrate including at least one via hole and a via formed therein to connect circuit wirings respectively formed on both sides of the substrate; a patterned wiring layer formed by printing a conductive paste composition in a predetermined circuit wiring pattern on each of both sides of the flexible substrate; an electroless metal plating layer formed on the patterned wiring layer; and a metal plating layer additionally formed on the electroless metal plating layer to increase electrical conductivity of a wiring including the patterned wiring layer and the electroless metal plating layer formed on each of both sides of the flexible substrate, wherein the circuit wirings respectively patterned on both sides of the flexible substrate are electrically connected to each other through the via formed in the via hole. Also provided is a method of manufacturing the same.

主权项

1. A double-sided flexible printed circuit board, comprising
a flexible substrate including at least one via hole and a via formed therein to connect circuit wirings respectively formed on both sides of the substrate; a patterned wiring layer formed by printing a conductive paste composition in a predetermined circuit wiring pattern on each of both sides of the flexible substrate; an electroless metal plating layer formed on the patterned wiring layer; and a metal plating layer additionally formed on the electroless metal plating layer to increase electrical conductivity of a wiring comprising the patterned wiring layer and the electroless metal plating layer formed on each of both sides of the flexible substrate, wherein the circuit wirings respectively patterned on both sides of the flexible substrate are electrically connected to each other through the via formed in the via hole.