MICROELECTRONIC PACKAGES HAVING EMBEDDED SIDEWALL SUBSTRATES AND METHODS FOR THE PRODUCING THEREOF

摘要

Methods for fabricating microelectronic packages and microelectronic packages are provided. In one embodiment, the microelectronic package fabrication method includes producing a molded panel containing a sidewall substrate. The molded panel is singulated to produce a Fan-Out Wafer Level Package core including a molded body having a fan-out region in which the sidewall substrate is embedded. A side connect trace is printed or otherwise formed on a sidewall of the Fan-Out Wafer Level Package core and extends at least partially across the embedded sidewall substrate.

主权项

1. A method for producing a microelectronic package, the method comprising:
embedding a sidewall substrate in a molded panel; singulating the molded panel to produce a Fan-Out Wafer Level Package (FO-WLP) core having a sidewall at which the sidewall substrate is exposed; and forming a side connect trace on the sidewall of the FO-WLP core and extending at least partially across the embedded sidewall substrate.