发明名称 |
LOW RESISTANCE AND DEFECT FREE EPITAXIAL SEMICONDUCTOR MATERIAL FOR PROVIDING MERGED FinFETs |
摘要 |
A gate structure is formed straddling a first portion of a plurality of semiconductor fins that extend upwards from a topmost surface of an insulator layer. A dielectric spacer is formed on sidewalls of the gate structure and straddling a second portion of the plurality of semiconductor fins. Epitaxial semiconductor material portions that include a non-planar bottommost surface and a non-planar topmost surface are grown from at least the exposed sidewalls of each semiconductor fin not including the gate structure or the gate spacer to merge adjacent semiconductor fins. A gap is present beneath epitaxial semiconductor material portions and the topmost surface of the insulator layer. A second epitaxial semiconductor material is formed on the epitaxial semiconductor material portions and thereafter the second epitaxial semiconductor material is converted into a metal semiconductor alloy. |
申请公布号 |
US2015380314(A1) |
申请公布日期 |
2015.12.31 |
申请号 |
US201414524246 |
申请日期 |
2014.10.27 |
申请人 |
International Business Machines Corporation |
发明人 |
CHAN Kevin K.;KE Yue;LEVESQUE Annie;PARK Dae-Gyu;RAMACHANDRAN Ravikumar;TESSIER Amanda L.;YANG Min |
分类号 |
H01L21/8234;H01L21/02;H01L21/265;H01L29/66;H01L21/223;H01L29/78;H01L21/285 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a semiconductor device comprising:
providing a plurality of semiconductor fins extending upward from a topmost surface of an insulator layer; forming a gate structure straddling a first portion of each semiconductor fin of said plurality semiconductor fins; forming a dielectric spacer on a sidewall of each side of said gate structure and straddling a second portion of each semiconductor fin of said plurality of semiconductor fins; merging an adjacent pair of semiconductor fins of said plurality of semiconductor fins, wherein said merging comprises forming an epitaxial semiconductor material portion comprising a first epitaxial semiconductor material and having a non-planar bottommost surface and a non-planar topmost surface on at least sidewalls of each exposed semiconductor fin portion; forming a second epitaxial semiconductor material that comprises a different semiconductor material than said first epitaxial semiconductor material on said bottommost surface and topmost surface of each epitaxial semiconductor material portion; and converting said second epitaxial semiconductor material into a metal semiconductor alloy. |
地址 |
Armonk NY US |