| 发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A printed circuit board including a metal conductor formed on a surface of an insulating base material and having a component mounting portion, and a solder resist covering a part of the metal conductor, includes a thinned part on a component-mounting-portion side in the solder resist. |
| 申请公布号 |
US2015382456(A1) |
申请公布日期 |
2015.12.31 |
| 申请号 |
US201514753165 |
申请日期 |
2015.06.29 |
| 申请人 |
FANUC CORPORATION |
发明人 |
SAIDOU Norihiro;OKOUCHI Yuichi |
| 分类号 |
H05K1/02;H05K3/34;H05K1/18 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board including, an insulating base material, a metal conductor formed on a surface of the insulating base material and having a component mounting portion to which an electronic component is electrically connected, and a solder resist covering a part of the metal conductor, comprising:
a thinned part formed on a component-mounting-portion side and having a thickness thinner than the other part thereof, in the solder resist. |
| 地址 |
Yamanashi JP |
