发明名称 |
CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Embodiments of the present invention provide a camera module and a method of manufacturing the same, the camera module comprising a sensor assembly, at least one semiconductor substrate, and a molding compound; wherein the sensor assembly comprises a semiconductor die, a sensor circuit disposed on the top surface of the semiconductor die, and a transparent cover coupled to the semiconductor die over the top surface of the semiconductor die; wherein each semiconductor substrate is disposed around the sensor assembly in a horizontal direction; and wherein the molding compound is filled between each semiconductor substrate and the sensor assembly. |
申请公布号 |
US2015380454(A1) |
申请公布日期 |
2015.12.31 |
申请号 |
US201514750859 |
申请日期 |
2015.06.25 |
申请人 |
STMicroelectronics (Shenzhen) R&D Co. Ltd |
发明人 |
Luan Jing-En |
分类号 |
H01L27/146;H04N5/369 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. A camera module, comprising:
a sensor assembly having:
a semiconductor die;a sensor circuit disposed on the top surface of the semiconductor die; anda transparent cover coupled to the semiconductor die over the top surface of the semiconductor die; at least one semiconductor substrate each being disposed around the sensor assembly in a horizontal direction; and a molding compound filled between each semiconductor substrate and the sensor assembly. |
地址 |
Shenzhen CN |