Glass/Ceramic Replacement of Epoxy for High Temperature Hermetically Sealed Non-Axial Electronic Packages

摘要

A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.

主权项

1. A high temperature, non-cavity package for non-axial electronics comprising:
a lead frame comprising a die pad and at least one lead extending therefrom; at least one semiconductor die, the semiconductor die bonded to the pad, lead frame with a first metal braze comprising a silver colloid; a connector adapted to provide electrical interconnections between the at least one lead and the at least one semiconductor die, the connector bonded to the die and the pad, lead frame with a second metal braze, said second metal braze comprising said silver colloid; and a glass ceramic compound encapsulating the at least one semiconductor die, the die pad, the connector and a portion of the at least one lead, wherein said glass ceramic compound is heated to chemically bond said glass ceramic compound to said metal plated pad, said semiconductor die, and said connector.