| 发明名称 |
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. The boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm. |
| 申请公布号 |
US2015382471(A1) |
申请公布日期 |
2015.12.31 |
| 申请号 |
US201514846084 |
申请日期 |
2015.09.04 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
FURUTANI Toshiki;Mikado Yukinobu;Shimabe Toyotaka;Kato Shinobu |
| 分类号 |
H05K1/18;H05K3/10;H05K1/02;H05K1/11;H05K3/30 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring board, comprising:
a substrate which has a plurality of opening portions and at least one boundary portion separating the opening portions; a plurality of electronic devices positioned in the plurality of opening portions of the substrate, respectively; a conductive pattern formed on a surface of the boundary portion; and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the plurality of electronic devices in the plurality of opening portions of the substrate, wherein the boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm. |
| 地址 |
Ogaki-shi JP |
