| 发明名称 |
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A package apparatus comprises a first wiring layer, a first conductive pillar layer, a first molding compound layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface that are arranged opposite to each other. The first conductive pillar layer is disposed on the second surface of the first wiring layer, whereas the first conductive pillar layer is a non-circular conductive pillar layer. The first molding compound layer is disposed within a specific portion of the first wiring layer and the first conductive pillar layer. The second wiring layer is disposed on the first molding compound layer and one end of the first conductive pillar layer. The protection layer is disposed on the first molding compound layer and the second wiring layer. |
| 申请公布号 |
US2015382469(A1) |
申请公布日期 |
2015.12.31 |
| 申请号 |
US201414492716 |
申请日期 |
2014.09.22 |
| 申请人 |
PHOENIX PIONEER TECHNOLOGY CO., LTD. |
发明人 |
HU Chu-Chin;HSU Shih-Ping;CHOU E-Tung |
| 分类号 |
H05K1/18;H05K3/40;H05K3/28;H05K1/14;H05K3/34 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package apparatus, comprising:
a first wiring layer, having a first surface and a second surface that are arranged opposite to each other; a first conductive pillar layer, disposed on the second surface of the first wiring layer, while being formed as a non-circular conductive pillar layer; a first molding compound layer, disposed within a specific portion of the first wiring layer and the first conductive pillar layer; a second wiring layer, disposed on the first molding compound layer and one end of the first conductive pillar layer; and a protection layer, disposed on the first molding compound layer and the second wiring layer. |
| 地址 |
Hsinchu County TW |
