| 发明名称 |
ELECTROLESS SURFACE TREATMENT PLATED LAYERS OF PRINTED CIRCUIT BOARD AND METHOD FOR PREPARING THE SAME |
| 摘要 |
An electroless surface treatment plated layer of a printed circuit board, a method for preparing the same, and printed circuit board including the same. The electroless surface treatment plated layer includes: electroless nickel (Ni) plated coating/palladium (Pd) plated coating/gold (Au) plated coating, wherein the electroless nickel, palladium, and gold plated coatings have thicknesses of 0.02 to 1 μm, 0.01 to 0.3 μm, and 0.01 to 0.5 μm, respectively. In the electroless surface treatment plated layer of the printed circuit board, a thickness of the nickel plated coating is specially minimized to 0.02 to 1 μm, thereby making it possible to form an optimized electroless Ni/Pd/Au surface treatment plated layer. |
| 申请公布号 |
US2015382452(A1) |
申请公布日期 |
2015.12.31 |
| 申请号 |
US201514847232 |
申请日期 |
2015.09.08 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
LEE Dong Jun;JEON Dong Ju;PANG Jung Youn;CHO Seong Min;KIM Chi Seong |
| 分类号 |
H05K1/02;H05K1/09;B32B15/01;H05K3/18 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electroless surface treatment plated layer of an electroless printed circuit board, the electroless surface treatment plated layer comprising:
nickel (Ni) plated coating, palladium (Pd) plated coating, gold (Au) plated coating, wherein each of the nickel, palladium, and gold plated coatings has a thickness of 0.02 to 1 μm, 0.01 to 0.3 μm, and 0.01 to 0.5 μm. |
| 地址 |
Suwon-si KR |
