发明名称 MODULE ASSEMBLY AND DISPLAY DEVICE
摘要 A module assembly is provided. The module assembly includes a back bezel, a heating member, and a thermal expansion member. The heating member is fixed on a first surface of the back bezel. The thermal expansion member is fixed on the heating member. The thermal expansion member has a first thermal expansion coefficient. The heating member is used to provide heat for the thermal expansion member. The thermal expansion member undergoes a first deformation based on the heat, so that the back bezel undergoes a second deformation. A display panel has a desired curved surface displaying effect on actual demands.
申请公布号 US2015382447(A1) 申请公布日期 2015.12.31
申请号 US201414387682 申请日期 2014.07.07
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 HSIAO Yu-Chun;YU Gang;LI Dehua
分类号 H05K1/02;H05K5/00 主分类号 H05K1/02
代理机构 代理人
主权项 1. A module assembly, comprising: a back bezel; a heating member fixed on a first surface of the back bezel; and a thermal expansion member fixed on the heating member and having a first thermal expansion coefficient, wherein the heating member is used to provide heat for the thermal expansion member, the thermal expansion member undergoes a first deformation based on the heat provided by the heating member and applies a first active force to the back bezel so that the back bezel undergoes a second deformation; the first heating member and the second heating member include a heating wire or a heating block; the back bezel includes a first board having a second thermal expansion coefficient; and the second thermal expansion coefficient is less than the first thermal expansion coefficient.
地址 Shenzhen, Guangdong CN