发明名称 |
MODULE ASSEMBLY AND DISPLAY DEVICE |
摘要 |
A module assembly is provided. The module assembly includes a back bezel, a heating member, and a thermal expansion member. The heating member is fixed on a first surface of the back bezel. The thermal expansion member is fixed on the heating member. The thermal expansion member has a first thermal expansion coefficient. The heating member is used to provide heat for the thermal expansion member. The thermal expansion member undergoes a first deformation based on the heat, so that the back bezel undergoes a second deformation. A display panel has a desired curved surface displaying effect on actual demands. |
申请公布号 |
US2015382447(A1) |
申请公布日期 |
2015.12.31 |
申请号 |
US201414387682 |
申请日期 |
2014.07.07 |
申请人 |
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
HSIAO Yu-Chun;YU Gang;LI Dehua |
分类号 |
H05K1/02;H05K5/00 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A module assembly, comprising:
a back bezel; a heating member fixed on a first surface of the back bezel; and a thermal expansion member fixed on the heating member and having a first thermal expansion coefficient, wherein the heating member is used to provide heat for the thermal expansion member, the thermal expansion member undergoes a first deformation based on the heat provided by the heating member and applies a first active force to the back bezel so that the back bezel undergoes a second deformation; the first heating member and the second heating member include a heating wire or a heating block; the back bezel includes a first board having a second thermal expansion coefficient; and the second thermal expansion coefficient is less than the first thermal expansion coefficient. |
地址 |
Shenzhen, Guangdong CN |