| 发明名称 |
PATCH DEVICE |
| 摘要 |
The present disclosure relates to a patch device attached to a head to apply electrical stimulation to a brain, comprising, in accordance with one exemplary embodiment of the present invention, a flexible board comprising a first side and a second side placed on the opposite of the first side, bendable along with a curve of the head; a stimulation control circuit formed on the first side of the flexible board and controlling a current applied to a plurality of adhesion portion; a cover layer formed on the stimulation control circuit in order to cover the first side; and a plurality of adhesion portion adhered to the head when the patch device is attached to the head, formed on the second side of the flexible board separately from each other for insulation. |
| 申请公布号 |
US2015374972(A1) |
申请公布日期 |
2015.12.31 |
| 申请号 |
US201514755787 |
申请日期 |
2015.06.30 |
| 申请人 |
YBRAIN INC. |
发明人 |
LEE Kiwon |
| 分类号 |
A61N1/04;A61B5/00;A61N1/36;A61B5/0478;A61N1/30 |
主分类号 |
A61N1/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A patch device attached to a head to apply electrical stimulation to a brain,
comprising a flexible board comprising a first side and a second side placed on the opposite of the first side, bendable along with a curve of the head; a stimulation control circuit formed on the first side of the flexible board and controlling a current applied to a plurality of adhesion portion; a cover layer formed on the stimulation control circuit in order to cover the first side; and a plurality of adhesion portion adhered to the head when the patch device is attached to the head, formed on the second side of the flexible board separately from each other for insulation, wherein at least a part of the flexible board is exposed by a plurality of the adhesion portions, and adhered to the head when the patch device is attached to the head. |
| 地址 |
Seoul KR |
