WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS

摘要

A joined structure which is configured such that a space between adjacent substrates is filled with a filling material. The joined structure includes a first substrate having a first conductor formed on a surface of the first substrate, a second substrate having a second conductor formed on a surface of the second substrate, arranged so that a surface of the first substrate faces a surface of the second substrate, a connecting conductor which electrically connects the first conductor and the second conductor, and a filling material between the first substrate and the second substrate. The filling material is formed into such a shape that a space is provided which corresponds to at least one of the first conductor, the second and the connecting conductor.

主权项

1. A joined structure comprising:
a first substrate having a first conductor formed on a surface of the first substrate; a second substrate having a second conductor formed on a surface of the second substrate and being arranged so that the second surface faces the first substrate; a connecting conductor for electrically connecting the first conductor and the second conductor to each other; and a filling material between the first substrate and the second substrate, wherein the filling material is formed into such a shape that a space is provided so as to correspond to at least one of the first conductor, the second conductor and the connecting conductor.