发明名称 SUBSTRATE SUPPORT PLATE FOR PLASMA PROCESSING APPARATUS
摘要 According to the present invention, a substrate support plate for a plasma processing apparatus comprises: an upper plate (100) provided with a plurality of opening parts formed thereon to expose an upper portion of a substrate (W) and a plurality of substrate storage frames (110) each having a stopping protrusion (120) disposed on an upper end of an inner circumferential surface thereof overlapping with an edge portion of an upper surface of the substrate, wherein an edge circumference portion (140) thereof is extended downwards; and a lower plate (200) provided with a plurality of elevated portions (210) each formed larger than a diameter of the substrate (W) to allow an edge portion thereof to face a lower surface of the upper plate (100) and provided with one or more cooling gas supply holes (215) to supply cooling gas to a lower surface of the substrate (W), and one or more opening parts (220, 230) formed on a portion thereof except the elevated portions (210), inserted into the inside of the edge circumference portion (140) of the upper plate (100), and fixed on the lower surface of the upper plate (100) by a mounting means. A sealing member (180) is installed between an edge of a lower surface of the stopping protrusion (120) of each substrate storage frame (110) of the upper plate (100) and an edge of the upper surface of the substrate (W).
申请公布号 KR20150146219(A) 申请公布日期 2015.12.31
申请号 KR20140076469 申请日期 2014.06.23
申请人 SEKYO CO., LTD. 发明人 JEON, JONG GEUN
分类号 H01L21/683 主分类号 H01L21/683
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