RESIN COMPOSITION FOR ENCAPSULATING OPTICAL ELEMENT

摘要

The present invention relates to a resin composition for encapsulating an optical device and more particularly, the resin composition for encapsulating optical device of the invention comprising a polyhedral oligomeric silsesquioxane (POSS) of which the compatibility with resins is enhanced by its cross-linking ability and an organic polysilazane compound has excellent mechanical properties, and enhanced adhesive strengths to a base material and barrier properties against moisture or oxygen by having excellent solubility with siloxane resins and significantly improved outgassing phenomenon, thus being able to be applied to encapsulation process for various optical devices, especially the encapsulation process of thick films.

主权项

1. A resin composition for an encapsulating optical device, comprising
1) a polyhedral oligomeric silsesquioxane (POSS) of the following chemical formula 1-1 or 1-2; and 2) an organic polysilazane of the following chemical formula 2: wherein, R is each independently a compound of the following chemical formula 3-1 or 3-2; wherein, R1 to R6 are each independently a hydrogen, an alkyl or alkenyl having 1 to 20 carbon atoms, or an aryl having 6 to 50 carbon atoms; Ra is each independently a hydrogen or chlorine; z is an integer of 3 to 20; a and b are each independently an integer of 0 to 20, with the proviso that a+b is an integer of 3 to 20; M, Ma and Mb are each independently a methyl or phenyl, Rx and Ry are each independently an alkyl or alkenyl having 1 to 20 carbon atoms, or an aryl having 6 to 50 carbon atoms; and m and n are each independently an integer of 1 to 20, with the proviso that m+n is 2 to 21.