发明名称 CHAMBER APPARATUS FOR CHEMICAL ETCHING OF DIELECTRIC MATERIALS
摘要 Implementations of the disclosure generally provide an improved pedestal heater for a processing chamber. The pedestal heater includes a temperature-controlled plate having a first surface and a second surface opposing the first surface. The temperature-controlled plate includes an inner zone comprising a first set of heating elements, an outer zone comprising a second set of heating elements, the outer zone surrounding the inner zone, and a continuous thermal choke disposed between the inner zone and the outer zone, and a substrate receiving plate having a first surface and a second surface opposing the first surface, the second surface of the substrate receiving plate is coupled to the first surface of the temperature-controlled plate. The continuous thermal choke enables a very small temperature gradient to be created and manipulated between the inner zone and the outer zone, allowing center-fast or edge-fast etching profile to achieve on a surface of the substrate.
申请公布号 US2015380220(A1) 申请公布日期 2015.12.31
申请号 US201514747367 申请日期 2015.06.23
申请人 Applied Materials, Inc. 发明人 TAN Tien Fak;LUBOMIRSKY Dmitry;FLOYD Kirby H.;NGUYEN Son T.;PALAGASHVILI David;TAM Alexander;CHEN Shaofeng
分类号 H01J37/32 主分类号 H01J37/32
代理机构 代理人
主权项 1. A pedestal heater for a processing chamber, comprising: a temperature-controlled plate having a first surface and a second surface opposing the first surface, comprising: a first zone comprising a first set of heating elements;a second zone comprising a second set of heating elements, the second zone surrounding the first zone; anda continuous annular thermal choke disposed between the first zone and the second zone; and a substrate receiving plate having a first surface and a second surface opposing the first surface, the second surface of the substrate receiving plate is coupled to the first surface of the temperature-controlled plate.
地址 Santa Clara CA US