SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes a printed circuit board having a first surface and a second surface on a side opposite to the first surface. First pads are on the first surface of the printed circuit board. An interface part is mounted on the printed circuit board via the first pads and is configured to transfer a signal between the interface part and a host device. Second pads are also on the first surface and insulated from the interface part. A semiconductor memory and a controller are mounted on the first surface. First solder balls electrically connect the first pads and the controller. Second solder balls electrical connect the second pads and the controller. A plurality of third pads are disposed on the second surface and electrically connected to the second pads allowing direct connections to the controller and memory via the second pads.

主权项

1. A semiconductor device, comprising:
a printed circuit board having a first surface and a second surface opposite the first surface; an interface part mounted on the printed circuit board, the interface part being configured to transfer a signal between the interface part and a host device; a plurality of first pads on the first surface of the printed circuit board and electrically connected to the interface part; a plurality of second pads on the first surface of the printed circuit board and electrically insulated from the interface part; a semiconductor memory mounted on the first surface; a controller configured to control the semiconductor memory; a plurality of first solder balls electrically connected to the controller and on the first pads; a plurality of second solder balls electrically connected to the controller and on the second pads; and a plurality of third pads on the second surface of the printed circuit board and electrically connected to the plurality of second pads, respectively.