发明名称 |
TOUCH PANEL STRUCTURE, METHOD FOR MANUFACTURING TOUCH PANEL STRUCTURE AND METHOD FOR MANUFACTURING DISPLAY APPARATUS |
摘要 |
In a lead-out wiring area, a protective conductive film is formed on a bottom surface and a side surface of a first contact hole including a surface of a first low resistance conductive film, and a part of a surface of an upper interlayer insulating film, and a second protective conductive film is formed on a bottom surface and a side surface of a second contact hole including a surface of a second low resistance conductive film, and a part of the surface of the upper interlayer insulating film. Then, a lower layer terminal part for a lower layer wiring line is formed of a laminated structure of the first low resistance conductive film and the first protective conductive film, and an upper layer terminal part for an upper layer wiring line is formed of a laminated structure of the second low resistance conductive film and the second protective conductive film. |
申请公布号 |
US2015378475(A1) |
申请公布日期 |
2015.12.31 |
申请号 |
US201514741543 |
申请日期 |
2015.06.17 |
申请人 |
Mitsubishi Electric Corporation |
发明人 |
HAYASHI Masami;AOKI Masaru;TAKEGUCHI Toru |
分类号 |
G06F3/044;G02F1/1333 |
主分类号 |
G06F3/044 |
代理机构 |
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代理人 |
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主权项 |
1. A touch panel structure comprising:
a substrate having a first main surface and a second main surface; a touch panel layer formed on the first main surface of said substrate, and having a display area, and a lead-out wiring area where an external terminal part for external connection is provided; and a color filter layer formed on the second main surface of said substrate, said color filter layer being formed to overlap with said display area of said touch panel layer in plan view, wherein said touch panel layer includes a laminated wiring line formed by laminating a lower conductive film, a low reflection film, and a transparent film in this order, said touch panel layer further includes:
an interlayer insulating film formed to cover said laminated wiring line;an opening selectively formed in said lead-out wiring area, passing through said interlayer insulating film, said transparent film, and said low reflection film, and having a bottom surface that is an exposed surface of said lower conductive film; anda protective conductive film formed on the bottom surface including said lower conductive film and a side surface of said opening, and said lower conductive film and said protective conductive film function as said external terminal part. |
地址 |
Tokyo JP |