Micromechanical sensor device

摘要

A micromechanical sensor device includes: a MEMS element; an ASIC element; a bonding structure provided between the MEMS element and the ASIC element; a layer assemblage having insulating layers and functional layers disposed alternatingly on one another; a sensing element movable in a sensing direction provided in at least one of the functional layers; a spacing element for providing a defined spacing between the MEMS element and the ASIC element being provided by way of a further functional layer; an abutment element having the spacing element and a first bonding layer being disposed on the sensing element; and an insulating layer being disposed on the ASIC element in an abutment region of the abutment element.

主权项

1. A micromechanical sensor device, comprising:
a MEMS element; an ASIC element; a bonding structure provided between the MEMS element and the ASIC element; a layer assemblage having at least one insulating layer and at least one functional layer disposed alternatingly on one another, wherein a sensing element movable in a sensing direction is provided in the at least one functional layer; a spacing element for providing a defined spacing between the MEMS element and the ASIC element, wherein the spacing element is provided in a further functional layer; and an abutment element having the spacing element and a first bonding layer is disposed on the sensing element, wherein an insulating layer is disposed on the ASIC element in an abutment region of the abutment element.