发明名称 |
OPTOELECTRONIC PACKAGE |
摘要 |
A optoelectronic package includes an inner package with a dielectric substrate having at least a first dielectric level with a photodetector (PD) die on a die attach area, first routing connecting a first contact to a first external bond pad (FEBP), and second routing connecting a second contact to a second external bond pad (SEBP). An outer package (OP) includes a ceramic substrate including a light source die on a base portion in direct line of sight with the PD including a first electrode and second electrode. A first wire bond connects the FEBP to a first terminal, a second wire bond connects the SEBP to a second terminal, a third wire bond connects the first electrode to a third terminal, and a fourth wire bond connects the second electrode to a fourth terminal. |
申请公布号 |
US2015380895(A1) |
申请公布日期 |
2015.12.31 |
申请号 |
US201414319696 |
申请日期 |
2014.06.30 |
申请人 |
Texas Instruments Incorporated |
发明人 |
WONG WILL KIANG;PARSA ROOZBEH;FRENCH WILLIAM;NAKANISHI NOBORU |
分类号 |
H01S5/022;H01S5/183;H01L31/02;H01L31/0232;H01L31/0203 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
1. An optoelectronic package, comprising:
an inner package including a first dielectric substrate including at least a first dielectric level having a photodetector (PD) die on a die attach area including a first contact and a second contact, first routing connecting said first contact to a first external bond pad (FEBP) and second routing connecting said second contact to a second external bond pad (SEBP); said inner package inside an outer package (OP) including a second ceramic substrate including a base portion, at least one light source die including a first electrode and second electrode on said base portion positioned to face said PD die to be in a direct line of sight with an emitting area of said light source die, a first wire bond connecting said FEBP to a first terminal of said OP, a second wire bond connecting said SEBP to a second terminal of said OP, a third wire bond connecting said first electrode to a third terminal of said OP, and a fourth wire bond connecting said second electrode to a fourth terminal of said OP. |
地址 |
Dallas TX US |