| 摘要 |
The light emitting device of an embodiment includes a sub mount, first and second metal pads which are separated in a horizontal direction on the sub mount, a light emitting structure which includes first and second conductivity type semiconductor layers which are arranged on the sub mount and are respectively connected to the first and second metal pads, and an active layer which is arranged between the first and second conductivity type semiconductor layers, first and second bumps which are respectively connected to the first and second metal pads and the first and second conductivity type semiconductor layers, and first and second electrodes which are respectively connected to the first and second bumps and the first and second conductivity type semiconductor layers; and a heat blocking layer which is arranged in at least one of the first and second electrodes. |
