发明名称 |
Fan-Out Package Structure and Methods for Forming the Same |
摘要 |
A package includes a device die including a first plurality of metal pillars at a top surface of the device die. The package further includes a die stack including a plurality of dies bonded together, and a second plurality of metal pillars at a top surface of the die stack. One of the device die and the plurality of dies includes a semiconductor substrate and a through-via penetrating through the semiconductor substrate, A polymer region includes portions encircling the device die and the die stack, wherein a bottom surface of the polymer region is substantially level with a bottom surface of the device die and a bottom surface of the die stack. A top surface of the polymer region is level with top ends of the first and the second plurality of metal pillars. Redistribution lines are formed over the first and the second plurality of metal pillars. |
申请公布号 |
US2015380388(A1) |
申请公布日期 |
2015.12.31 |
申请号 |
US201514845593 |
申请日期 |
2015.09.04 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Yeh Der-Chyang |
分类号 |
H01L25/065;H01L23/31 |
主分类号 |
H01L25/065 |
代理机构 |
|
代理人 |
|
主权项 |
1. A package comprising:
a device die comprising a first plurality of metal pillars at a top surface of the device die; a die stack comprising:
a plurality of dies bonded together, wherein one of the device die and the plurality of dies comprises a semiconductor substrate and a through-via penetrating through the semiconductor substrate; anda second plurality of metal pillars at a top surface of the die stack; an encapsulating material encapsulating the device die and the die stack therein, wherein a top surface of the encapsulating material is level with top ends of the first plurality of metal pillars and top ends of the second plurality of metal pillars; and redistribution lines over and electrically coupled to the first and the second plurality of metal pillars. |
地址 |
Hsin-Chu TW |