SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT SEMICONDUCTORS

摘要

A system and method are provided for enabling the production of semiconductors requiring very high precision thermo-compression bonding, the system comprising a thermo-compression bonding system having force and/or distance measuring sensors configured to sense thermal expansion of system components and a controller configured to counteract such expansion by exercising appropriate control over such system. This system and method may be used for both constant force profile applications as well as those requiring variable force during a bonding operation.

主权项

1. A system for thermo-compression bonding of high-bump count semiconductors, the system comprising:
a die head comprising a planar surface; a substrate head comprising a planar surface, wherein said planar surface of said substrate head is oriented to oppose said planar surface of said die head; wherein said planar surfaces of said die head and said substrate head are substantially parallel and capable of motion relative to one another in at least the axis perpendicular to their respective planar surfaces, such that they may be brought into compressing contact with one another; at least one force sensor configured to measure compressive forces between said substantially parallel planar surfaces of said die head and said substrate head during a bonding operation; and a controller in communication with said force sensor configured to continuously control the relative position of said substantially parallel planar surfaces of said die head and said substrate head during a bonding operation to maintain a desired compressive force, whereby thermal expansion of said die and substrate heads is continuously compensated for during a thermo-compression bonding operation.