| 摘要 |
An electronic component (21) includes a substrate (22), a functional section provided on the substrate (22), and a sealing body (27) which is provided on the substrate (22) and seals the functional section. In a temperature region (TB1) having a lowest temperature (LB 1) that is at least as high as the glass transition temperature (TgA) of the sealing body (27), the coefficient of linear expansion (±A) of the sealing body (27) is greater than the coefficient of linear expansion (±X, ±Y) of the substrate (22). In a temperature region (TB2) having a highest temperature (UB2) that is lower than the glass transition temperature (TgA) of the sealing body (27), the coefficient of linear expansion (±A) of the sealing body (27) is less than the coefficient of linear expansion (±X, ±Y) of the substrate (22). The electronic component (21) exhibits superior reliability even upon prolonged use. |
