| 摘要 |
A cooling device (10) has an opening (3a) formed in a cooling plate (3) for cooling an electronic component (1), and an electronic-component-accommodating part (4) formed in the opening (3a). A cooling pipeline (6) is disposed so as to surround an outside surface part of the electronic-component-accommodating part (4), whereby the electronic component (1) and the cooling pipeline (6) are disposed at roughly the same height as the top of the cooling plate (3) to achieve a lower profile. In addition, the electronic-component-accommodating part (4), which is joined to the cooling plate (3), has a configuration in which a lateral side part (4a) thereof is in contact with a lateral side part of the electronic component (1) with a potting material (5) disposed therebetween, so that there is more surface area that contributes to heat dissipation. |
