CHIP ON BOARD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING SAME

摘要

Provided is a lower cost and better quality COF board by avoiding restrictions on the selection of a material for a film substrate thereof when the COF board is configured to be provided with an insulating protective film (15) for improving a migration-resistant property. A chip on board (1) is provided with a film substrate (11) formed from a thermoplastic resin, a metal wiring part (13) formed on the film substrate (11), and an insulating protective film (15) formed by heat-curable ink so as to cover parts of the film substrate (11) and the metal wiring part (13), the thermoplastic resin that forms the film substrate (11) is a thermoplastic resin subjected to annealing, and a temperature at which the thermal shrinkage of the thermoplastic resin is started is higher than or equal to the heat curing temperature of the heat-curable ink that forms the insulating protective film (15).