发明名称 HEADPHONE JACK ASSEMBLY AND ELECTRONIC DEVICE
摘要 A headphone jack assembly and electronic device; the headphone jack assembly comprises a headphone jack (101, 201, 301, 411, 511, 611) and an electromagnetic shielding component (102, 202, 302, 412, 512, 612); the headphone jack is electrically connected to a circuit board (203, 303, 420, 520, 620) in an electronic device; the electromagnetic shielding component is disposed on the periphery of the headphone jack, thus solving the problem that the headphone jack suffers electromagnetic interference from the antenna. In addition, electromagnetic radiation generated by each electronic component in the circuit board can be shielded by the electromagnetic shielding component disposed on the periphery of the headphone jack, thus preventing the headphone jack suffering electromagnetic interference.
申请公布号 WO2015196666(A1) 申请公布日期 2015.12.30
申请号 WO2014CN89299 申请日期 2014.10.23
申请人 XIAOMI INC. 发明人 SUN, WEI;GUO, FENG;LEI, ZHENFEI
分类号 H01R13/6581;H01R12/51 主分类号 H01R13/6581
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