CHEMICALLY ENHANCED POSITIVE-PHOTORESIST RESIN COMPOSITION FOR THICK FILM

摘要

The present invention relates to a chemically amplified photoresist composition for a thick film and, more specifically, to a chemically amplified photoresist composition for a thick film, which comprises: an acrylic binder resin; a first photosensitive acid-generating compound; a second acid-generating compound; and an acid-diffusion controlling agent. The present invention further relates to a method for producing a thick film photoresist pattern using the composition. The chemically amplified photoresist composition for the thick film of the present invention is capable of effectively controlling, even for a copper substrate, a footing phenomenon which can be occurred in the amplified thick film resist, thereby being able to produce a profile in a desired shape while controlling the same.