发明名称 |
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER |
摘要 |
A copper wire having a diameter of 10 to 80 μm, wherein the copper wire bulk material is ≥ 99.99 wt.-% pure copper or a copper alloy consisting of 10 to 1000 wt.-ppm of silver and/or of 0.1 to 3 wt.-% of palladium with copper as the remainder to make up 100 wt.- %, characterized in that the copper wire has a 0.5 to < 6 nm thin circumferential surface layer of copper oxide. |
申请公布号 |
WO2015197432(A1) |
申请公布日期 |
2015.12.30 |
申请号 |
WO2015EP63508 |
申请日期 |
2015.06.17 |
申请人 |
HERAEUS DEUTSCHLAND GMBH & CO. KG |
发明人 |
SARANGAPANI, MURALI;ZHANG, XI;YEUNG, PING HA;MILKE, EUGEN |
分类号 |
C22C19/00;C22F1/08 |
主分类号 |
C22C19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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