PHOTOCURABLE THERMOSETTING RESIN COMPOSITION FOR MANUFACTURING PRINTED CIRCUIT BOARD, DRY FILM, CURED PRODUCT, AND PRINTED CIRCUIT BOARD

摘要

A photocurable thermosetting resin composition for manufacturing a printed circuit board, a dry film, a cured product, and a printed circuit board. The photocurable thermosetting resin composition for manufacturing a printed circuit board contains: (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a photosensitive monomer, (D) a thermosetting component, and (E) a hollow filler.