A pressure sensor system having a pressure sensor chip is specified, which is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
申请公布号
EP2959281(A1)
申请公布日期
2015.12.30
申请号
EP20140700924
申请日期
2014.01.20
申请人
EPCOS AG
发明人
IHLE, JAN;PESCHKA, ANDREAS;HUNDERTMARK, BERT;BOHL, BENJAMIN;OSTRICK, BERNHARD