ALLUMINUM PLATING SOLUTION, ALUMINUM FILM MANUFACTURING METHOD, AND POROUS ALUMINUM OBJECT

摘要

Provided is an aluminum plating solution capable of continuously manufacturing an aluminum film, the surface of which is smooth and which has excellent elongation. The aluminum plating solution, which is capable of electrodepositing aluminum on a substrate surface: comprises, as components, (A) an aluminum halide, (B) at least one compound selected from a group consisting of alkylimidazolium halides, alkylpyridinium halides and urea compounds, and (C1) at least one species selected from a group consisting of ammonium salts, phosphonium salts, sulfonium salts, amine compounds, phospine compounds and sulfide compounds; the component (C1) has a C8-36 straight or branched alkyl group for at least one side chain; the mixing ratio of the component (A) with the component (B) is in the range of 1:1 - 3:1 in mole ratio; and the concentration of the component (C1) is 1.0 g/L to 45 g/L.