发明名称 LASER MACHINING METHOD AND LASER MACHINING DEVICE
摘要 Proposed is a laser machining method, in which laser machining is continued in an uninterrupted manner and with high accuracy while a workpiece is continuously moved at a fixed speed. Also proposed is a laser machining device. The laser machining method comprises a step in which, while a workpiece W is moved at a fixed speed in the X direction, the aim of a laser beam is made to scan, by means of a galvano scanner, in the X direction and the Y direction so that the laser beam draws a fixed trajectory within a galvano area, and the workpiece is irradiated by the laser beam at a prescribed position on the scanning line. The machining is carried out under the conditions and scope indicated by the formulas (1) Px/V ≧ Σ (Lt + Gt) and (2) Gx = Px × α, where Px is the reference machining pitch of the workpiece in the X direction, V is the movement speed of the workpiece in the X direction, Lt is the laser irradiation time, Gt is the galvano operation time (the aim movement time and settling time), Gx is the length of the galvano area in the X direction, and α is a constant (0 < α < 1).
申请公布号 WO2015199046(A1) 申请公布日期 2015.12.30
申请号 WO2015JP67941 申请日期 2015.06.23
申请人 MURATA MANUFACTURING CO.,LTD. 发明人 OTSUKA AKIRA;KURIHARA HIDEKAZU
分类号 B23K26/08;B23K26/00;B23K26/082 主分类号 B23K26/08
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