发明名称 |
DECOUPLING CAPACITORS AND ARRANGEMENTS |
摘要 |
Various embodiments of transistor assemblies, integrated circuit devices, and related methods are disclosed herein. In some embodiments, a transistor assembly may include a base layer in which a transistor is disposed, a first metal layer, and a second metal layer disposed between the base layer and the first metal layer. The transistor assembly may also include a capacitor, including a sheet of conductive material with a channel therein, disposed in the base layer or the second metal layer and coupled to a supply line of the transistor. Other embodiments may be disclosed and/or claimed. |
申请公布号 |
WO2015199722(A1) |
申请公布日期 |
2015.12.30 |
申请号 |
WO2014US44595 |
申请日期 |
2014.06.27 |
申请人 |
INTEL CORPORATION;BOU-GHAZALE, SILVIO E.;ELSAYED, RANY T.;GOEL, NITI |
发明人 |
BOU-GHAZALE, SILVIO E.;ELSAYED, RANY T.;GOEL, NITI |
分类号 |
H01L27/108;H01L21/8242 |
主分类号 |
H01L27/108 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|