| 摘要 |
The present invention relates to a light emitting diode, a package and a manufacturing method thereof. More specifically, the light emitting diode comprises: a substrate; a semiconductor layered structure formed by layering an n-type semiconductor layer, an activation layer, and a p-type semiconductor layer on the substrate; a p-type electrode and an n-type electrode connected to the p-type semiconductor layer and the n-type semiconductor layer, respectively; an interlayer insulation layer disposed on the p-type electrode and the n-type electrode and provided with an organic insulation layer made of an organic material; and a p-type and an n-type boding metal electrically connected to the p-type electrode and the n-type electrode, respectively. A reflective electrode is used to increase light emitting efficiency. Flexibility of the interlayer insulation layer and excellent thermal stability of the organic material are used to alleviate stress by heat and pressure. |
