CIRCUIT BOARD, DISPLAY PANEL AND DISPLAY DEVICE

摘要

An array substrate (11B) is provided with: a glass substrate that constitutes the array substrate (11B); an IC chip (20) that is arranged on the glass substrate; two ACFs (30) which are interposed between the glass substrate and the IC chip (20) and electrically connect the glass substrate and the IC chip (20) with each other, while being arranged separately from each other; and a resin film (32) that is arranged so as to fill the gap between the ACFs (30), which are adjacent to each other between the glass substrate and the IC chip (20), and is formed of a resin material having a curing shrinkage smaller than that of the ACFs (30).