发明名称 |
SILVER-BISMUTH POWDER, CONDUCTIVE PASTE AND CONDUCTIVE FILM |
摘要 |
To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 μm to 10 μm, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less. |
申请公布号 |
SG11201508728Y(A) |
申请公布日期 |
2015.12.30 |
申请号 |
SG11201508728Y |
申请日期 |
2014.03.27 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
OGI, KOZO;INOUE, KENICHI;EBARA, ATSUSHI;ASANO, AKIHIRO;FUJIMOTO, HIDEYUKI;YAMADA, TAKAHIRO |
分类号 |
B22F1/00;B22F7/04;B22F9/08;C22C5/06;C22C12/00;H01B1/00;H01B1/22;H01B5/00;H01B5/14;H05K1/09 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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